"Sheet1"
"HEL700",,,,,,700
,"在0°C时标称电阻Ω","温度系数","封装形式","温度范围(℃)","公差",,"在0°C时标称电阻Ω","温度系数","封装形式","温度范围(℃)","公差"
"HEL-700-T-0-A",100,3850,"Ribbon","-200℃～540℃","±0.2%","700-101BAA-B00",100,3850,"Lead","-70 至 500","±0.06 %"
"HEL-700-T-1-A",100,3850,"Ribbon","-200℃～540℃","±0.1%","700-101BAB-B00",100,3850,"Lead","-70 至 500"," ±0.12 %"
"HEL-700-T-0-B",100,3850,"Chip","-200℃～540℃","±0.2%","700-102AAB-B00",1000,3750,"Lead","-70 至 500","±0.12%"
"HEL-700-T-1-B",100,3850,"Chip","-200℃～540℃","±0.1%","700-102AAC-B00",1000,3750,"Lead","-70 至 500","±0.24%"
"HEL-700-U-0-A",1000,3750,"Ribbon","-200℃～540℃","±0.2%","700-102BAA-B00",1000,3850,"Lead","-70 至 500","±0.06 %"
"HEL-700-U-1-A",1000,3750,"Ribbon","-200℃～540℃","±0.1%","700-102BAB-B00",1000,3850,"Lead","-70 至 500"," ±0.12 %"
"HEL-700-U-0-B",1000,3750,"Chip","-200℃～540℃","±0.2%","701-101BAA-B00",100,3850,"Lead","-70 至 500","±0.06 %"
"HEL-700-U-1-B",1000,3750,"Chip","-200℃～541℃","±0.1%","701-101BAB-B00",100,3850,"Lead","-70 至 500"," ±0.12 %"
"HEL-700-U-0-C",1000,3750,"SMT","-200℃～540℃","±0.2%","701-102BAB-B00",1000,3850,"Lead","-70 至 500"," ±0.12 %"
"HEL-700-U-1-C",1000,3750,"SMT","-200℃～541℃","±0.1%","702-101BBB-A00",100,3850,"SMT","-50 至 130"," ±0.12 %"
,,,,,,"702-102BBB-A00",1000,3850,"SMT","-50 至 130"," ±0.12 %"
,,,,,,"703-101BBB-A00",100,3850,"SMT","-50 至 130"," ±0.12 %"
,,,,,,"703-102BBB-A00",1000,3850,"SMT","-50 至 130"," ±0.12 %"
,"700选型指南"
,700,"薄膜铂金RTD700系列"
,,"-101","0℃电阻为100Ω"
,,"-102","0℃电阻为1000Ω"
,,,"A","0.00375Ω/Ω/℃ DIN标准"
,,,"B","0.00385Ω/Ω/℃ DIN标准"
,,,,"A","工作温度范围-70至500℃"
,,,,"B","工作温度范围-50至130℃"
,,,,,"A","公差0.06%"
,,,,,"B","公差0.12%"
,,,,,"C","公差0.24%"
,,,,,,"-A00","封装Lead"
,,,,,,"-B00","封装SMT"
"Sheet2"
,700,"薄膜铂金RTD700系列"
,,"-101","0℃电阻为100Ω"
,,"-102","0℃电阻为1000Ω"
,,,"A","0.00375Ω/Ω/℃ DIN标准"
,,,"B","0.00385Ω/Ω/℃ DIN标准"

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